Manufacturing Defects Caused by Land Patterns
Elizabeth Bustamante
CAD Manager
SnapEDA
In This Webinar
Land patterns are largely overlooked but a fundamental step in the design process. Often, engineers do not realize that their manufacturing defects may be caused by poorly designed land patterns. Delving far beyond the basics, Elizabeth Bustamante investigates the more gnarly errors that trip up engineers and how to prevent costly prototype iterations and delays on your next project by bringing in more verification into your processes.
In this on-demand, she will answer:
- What are footprints/land patterns in a PCB?
- Footprint/land pattern types and dimensions
- Manufacturing defects caused by footprints/land patterns
- How to avoid footprint/land pattern defects in a PCB?
- Quality footprint/land pattern layout guidelines
- IPC standards
- Tips for an ideal footprint/land pattern generation scheme
About Elizabeth Bustamante
Elizabeth Bustamante is an electronics engineer and PCB designer. As the CAD manager at SnapEDA, she is responsible for leading a team of 11 engineers in the creation of PCB libraries, ensuring that the team is constantly evaluating and improving its quality, processes, and efficiency.
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