PCB Stack-Up Design Guide

Sierra Circuits’ PCB Stack-Up Design Guide provides guidelines for building an efficient stack-up with improved signal integrity, power distribution, and heat dissipation. 

12 CHAPTERS

55 PAGES

60 MINUTE READ

Download the PCB Stack-Up Design Guide today to maximize your functionalities

A stack-up refers to the sequential arrangement of copper and dielectric layers in a PCB. It communicates the layer order and essential details such as material thickness, copper weights, prepreg types, and the overall board thickness to the contract manufacturer.

The stack-up design significantly impacts PCB factors such as signal integrity, power distribution, and thermal management. It provides the mechanical support necessary to withstand physical stresses and environmental factors. A well-designed signal-to-ground plane arrangement minimizes cross-talk and signal distortions.

4 steps for designing a perfect stack-up:

1. Material selection: Choose materials based on your requirements. Consider electrical (D_k and D_f), thermal (CTE, T_g, T_d, and k), chemical, and mechanical properties.
2. Layer count estimation: Estimate the optimum number of layers based on the operating frequency, board dimensions, design complexity, and routing density. Have a symmetrical stack-up to avoid board deformation
3. Layer arrangement: Avoid placing adjacent signal layers and provide solid ground planes for short and continuous return paths.
4. Lamination cycles: Refrain from having more than 4 lamination cycles to avoid manufacturing issues.

Depending on the type of application, select the right build-up for maximum efficiency. Options include HDI, flexible, rigid-flex, and hybrid (mixed material) constructions.

We have put together this comprehensive PCB Stack-Up Design Guide with the help of industry experts who have hands-on experience in building complex circuit boards.

And don’t forget to try our Stackup Designer tool to design cost-optimized build-up structures.

What’s inside:

• Design guidelines for HDI, flex, and hybrid stack-ups
• Stack-up representation in fab drawing
• DFM checks for layer stacks
• Manufacturing tolerances
• Inspection methods
• PCB stack-up examples with illustrations