Seminar: PCB, Enclosure and Cabling Design to Control EMI
REGISTER NOW
February 24-25th, 2025 | 8 AM - 4 PM PT
PRICE: $595
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44
Days
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12
Hours
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11
Minutes
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40
Seconds
Rick Hartley
Principal Engineer at RHartley Enterprises
Online via Zoom
Following this event, you will receive:
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Presentation slides
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Certificate
Seminar abstract:
EMI occurs when a physical structure resonates, causing radiation of electromagnetic fields from the structure, at one or more frequencies. This usually results from improper design of the PC board(s), or the enclosure, or the cabling, and is typically NOT from an issue in the schematic.
Many engineers design PC boards and their surrounding structures, hoping to NOT fail EMI testing, but knowing they likely will. With an understanding of proper PC board, enclosure and cabling design, failing compliance testing is very avoidable. The key to success is knowing how to design these structures to properly control and contain the electric and magnetic fields.
The knowledge gained from this two-day seminar WILL reduce product develop time and cost and WILL vastly improve product performance.
This seminar is intended for PC board design engineers, electronic engineers and system engineers, as well as technicians and managers interested in EMI control at the PC board, enclosure and I/O cable levels.
Date and time:
February 24th and 25th, 2025
From 8:00 AM to 4:00 PM Pacific time
Register now!
Items discussed are:
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Energy movement in PC boards and how to control it
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Driving factors behind frequency in digital and analog circuits
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Common grounding problems that lead to EMI
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Improper use of planes in a printed circuit board
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Proper design and termination of transmission lines
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Routing techniques that cause EMI and how to avoid them
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Why some commonly used PCB design techniques cause EMI
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Component placement to prevent EMI
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Crosstalk in single-ended lines and differential lines
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Proper setup and routing of differential pairs
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Impact of IC package design on EMI
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Problems caused by poor connector pin assignment
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Problems caused by improper I/O connector location
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Proper PCB layout of switch mode power supplies
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PDN design and decoupling for low, medium and high-layer PCBs
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Ground planes- to split or NOT to split… that is the question
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Board stack-ups that cause EMI and those that resolve noise and EMI
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Problems with LCD displays
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Setup of the I/O structure to prevent EMI
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Proper shielding of I/O cables
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Proper chassis design to prevent EMI
About Rick Hartley
Rick Hartley, retired from L-3 Avionics, is the principal engineer of RHartley Enterprises, through which he consults and teaches internationally. Rick’s focus is on correct design of circuits and PC boards to prevent and/or resolve EMI, noise and signal integrity problems. He has consulted with major corporations in the US and 14 other countries. His career has focused on telecommunications, computers and aircraft avionics, as well as medical, appliance and automotive circuits. Rick has taught seminars at numerous conferences, including the IEEE EMC Symposium, PCB West, AltiumLive, Freescale Technology Forum, IPC Apex/Expo and others. He is on the Board of Directors of the ‘Printed Circuit Engineering Association’, is a past member of the Editorial Review Board of Printed Circuit Design Magazine and has written numerous technical papers and articles on methods to control noise, EMI and signal integrity.
