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Related Categories — KiCad Tutorials » PCB Assembly » PCB Design » PCB Manufacturing
12 PCB Thermal Management Techniques to Reduce Heating
Modern electronics use high-power components like high-performance processors, MOSFETs, high-power LEDs, IGBTs, etc. We know there is a trend in electronic industries to make these components smaller but this results in the creation of thermal hotspots. High temperatures at PCB thermal hotspots could result in device failure.
PCB Design
Design for Testing (DFT) Guidelines for PCB Manufacturing
Testing and examining a PCB after manufacturing is a pivotal factor in procuring a flawless design. Design for ... more »
PCB Assembly
Design and Manufacture of Staggered and Stacked Vias in PCBs
Staggered and stacked vias are well adapted nowadays. Their unique design enhances the density, as well as boosts ... more »
PCB Design
12 PCB Thermal Management Techniques to Reduce Heating
Modern electronics use high-power components like high-performance processors, MOSFETs, high-power LEDs, IGBTs, etc. We know there is a ... more »
PCB Design
Design for Testing (DFT) Guidelines for PCB Manufacturing
Testing and examining a PCB after manufacturing is a pivotal factor in procuring a flawless design. Design for ... more »
PCB Assembly
Design and Manufacture of Staggered and Stacked Vias in PCBs
Staggered and stacked vias are well adapted nowadays. Their unique design enhances the density, as well as boosts ... more »
PCB Design
OhmegaPly and TCR Materials with Embedded Passives Technology in PCB Manufacturing
OhmeagPly (resistive conductive material) and TCR material (thin-film resistor foil) follow the embedded passives technology (EPT), which manufactures ... more »
PCB Manufacturing
HDI Standard Board Tools for a Better PCB design
Unlike traditional PCBs, HDI boards can obtain interconnections through blind vias, buried vias, and microvias, instead of just ... more »
HDI / Blind & Buried Vias
ODB++: An Intelligent Format for PCB Designs
A side-by-side comparison of ODB++, Gerbers, and IPC-2581 PCB design formats. While ODB++ and IPC-2581 have recently been ... more »
PCB Design
Common Problems Associated With Gerber Files
The most common problems seen in Gerber files include design mismatch, insufficient clearances, obsolete file formats, unregistered layers, ... more »
PCB Design
Air Gap Construction Method in Rigid-Flex PCBs
Air gap construction method in rigid-flex PCB manufacturing was introduced by the IPC to overcome the mechanical and ... more »
Flex PCBs
DFM for Flex and Rigid-Flex PCBs Utilizing SMT
Design for manufacturing (DFM) guidelines resolve potential issues that can occur during the manufacturing and assembly of circuit ... more »
Flex PCBs
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards