Air gap construction method in rigid-flex PCB manufacturing was introduced by the IPC to overcome the mechanical and electrical reliability issues in higher layer count rigid-flex designs.
Flex PCBs
Effects of vibrations on PCBA causes fatigue and eventually fail some parts in space missions. These electronic devices ... more »
Defense & Space
J-STD-001 is a standard issued by IPC for soldered electrical and electronic assemblies. The standard specifies material specifications, ... more »
IPC
Air gap construction method in rigid-flex PCB manufacturing was introduced by the IPC to overcome the mechanical and ... more »
Flex PCBs
Effects of vibrations on PCBA causes fatigue and eventually fail some parts in space missions. These electronic devices ... more »
Defense & Space
J-STD-001 is a standard issued by IPC for soldered electrical and electronic assemblies. The standard specifies material specifications, ... more »
IPC
Circuit board manufacturers have invested in advanced modeling software and testing devices to specify the controlled impedance requirements ... more »
Controlled Impedance
The production of flex circuit boards is rising at a rapid rate in response to the increased demand. ... more »
Design Guidelines
Design for manufacturing (DFM) guidelines resolves potential issues that can occur during the manufacturing and assembly of circuit ... more »
Flex PCBs
The main agenda of using HDI technology is to pack more components on a smaller board. Choosing smaller ... more »
HDI / Blind & Buried Vias
Most modern devices employ differential signaling to meet high-speed and high data-rate needs. Controlling differential signaling in rigid ... more »
Controlled Impedance
Design for manufacturability (DFM) for HDI PCBs refers to designing layouts that reduce the errors associated with fabrication ... more »
Defense & Space
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