Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with microvias positioned […]
Case Studies
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
IPC-2152 is the standard for determining the current capacity, temperature rise, and width of a trace in a ... more »
IPC
Every PCB should be designed in such a way that the overall cost and chances of potential DFM ... more »
PCB Design
Turnkey PCB manufacturing services include design review, fabricating bare boards, procuring components, assembly, and testing of your prototype. ... more »
PCB Assembly
A PCB transmission line is a type of interconnection used for moving signals from their transmitters to their ... more »
Controlled Impedance
IPC-2221 is a generic standard for circuit board design. It lays down the requirements for PCB design and ... more »
IPC
Flex PCB design requires a slightly different approach than rigid PCBs. While flex PCBs can provide major savings ... more »
Flex PCBs
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.