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Related Categories — PCB Assembly
6 Common Solder Mask Errors Every PCB Designer Should Know
A solder mask is an insulation layer that covers conductive areas such as traces and pads. Inappropriate solder layer application […]
PCB Design
Case Study: Routing Microcontroller and BGA in Rigid-Flex PCBs
When routing microcontrollers and BGAs, you need to consider the trace spacing requirements of your design and clearance ... more »
Case Studies
Advantages of Ordering PCB Prototype and Bulk Production from a Single Fab House
Choosing the same fab house for PCB prototypes and bulk production has many advantages, such as better DFM ... more »
PCB Manufacturing
6 Common Solder Mask Errors Every PCB Designer Should Know
A solder mask is an insulation layer that covers conductive areas such as traces and pads. Inappropriate solder ... more »
PCB Design
Case Study: Routing Microcontroller and BGA in Rigid-Flex PCBs
When routing microcontrollers and BGAs, you need to consider the trace spacing requirements of your design and clearance ... more »
Case Studies
Advantages of Ordering PCB Prototype and Bulk Production from a Single Fab House
Choosing the same fab house for PCB prototypes and bulk production has many advantages, such as better DFM ... more »
PCB Manufacturing
How to Design and Build a Hybrid PCB Stackup
A hybrid stackup construction enhances your PCB’s performance and cost-effectiveness by combining different materials or technologies. It helps ... more »
PCB Manufacturing
Case Study: Eliminating BOM and Footprint Errors in PCB Assembly
Sticking to DFA benchmarks ensures components are correctly assembled on a PCB without any discrepancies. DFA brings down ... more »
Case Studies
Case Study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
How Sequential Lamination is Performed to Manufacture HDI PCBs
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
How to Optimize Your PCB Trace Using IPC-2152 Standard
IPC-2152 is the standard for determining the current capacity, temperature rise, and width of a trace in a ... more »
IPC
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