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Related Categories — High Speed » PCB Materials
The History of High Density Interconnect
Implementing HDI at modern levels involved making changes in materials, imaging, assembly, testing, and design. This article examines those changes and takes a look at what we might see in the near future, as HDI continues to change the way we look at complex, compact circuits and the devices they make possible.
HDI / Blind & Buried Vias
S3 Test Eases Laminate Selection
For her MIT master’s thesis in engineering, Michelle Rybak investigated signal loss over frequency of six different PCB ... more »
PCB Design
Steps To Your PCB Prototype (For Hardware Start-ups)
John Teel shares the steps to creating a successful prototype printed circuit board. This includes the design, fabrication ... more »
PCB Assembly
The History of High Density Interconnect
Implementing HDI at modern levels involved making changes in materials, imaging, assembly, testing, and design. This article examines ... more »
HDI / Blind & Buried Vias
S3 Test Eases Laminate Selection
For her MIT master’s thesis in engineering, Michelle Rybak investigated signal loss over frequency of six different PCB ... more »
PCB Design
Steps To Your PCB Prototype (For Hardware Start-ups)
John Teel shares the steps to creating a successful prototype printed circuit board. This includes the design, fabrication ... more »
PCB Assembly
Tips Every PCB Designer Should Know
A board design that will be produced in quantity had better take into account how it can be ... more »
PCB Design
Consult Your Fabricator, Especially for Hybrid Designs
For manufacturers, there’s yet another consideration besides chip load and that’s drill hit count; the sharper the drill, ... more »
Flex PCBs
Making Sub 3/3 A Reality
Prudent PCB designers used to have good reasons for avoiding trace widths and spaces smaller than 3 mils ... more »
PCB Design
Learning about High-Speed PCB Design
Progress in electronics may not depend so much on semiconductor advances as it does on a transition to ... more »
High Speed
For Microwave PCBs, Solder Mask Design Affects Cost
Yield ultimately governs the cost of fabrication. If panels must be reprocessed because solder mask fails to adhere ... more »
PCB Design
Manufacturing Profitable HDI PCBs
Yield Drives Profit The first step toward designing a printed circuit board is to identify the least expensive ... more »
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards