Choosing the right dielectric material for a PCB is important no matter what application you’re working. However, the stakes are higher with high-density interconnect (HDI) technologies.
HDI / Blind & Buried Vias
PCB via filling is a technique in which the plated hole is filled with a conductive or non-conductive ... more »
PCB Manufacturing
HDI designs pose complex routing challenges due to their tight spacing between components and traces. Using DRC settings in ... more »
HDI / Blind & Buried Vias
Choosing the right dielectric material for a PCB is important no matter what application you’re working. However, the ... more »
HDI / Blind & Buried Vias
PCB via filling is a technique in which the plated hole is filled with a conductive or non-conductive ... more »
PCB Manufacturing
HDI designs pose complex routing challenges due to their tight spacing between components and traces. Using DRC settings in ... more »
HDI / Blind & Buried Vias
After PCB fabrication, the copper traces on the board typically face the risk of oxidation and corrosion due ... more »
PCB Manufacturing
Impedance impacts how signals propagate through the board, how power is exchanged between components, and how signals leak ... more »
Controlled Impedance
Microvia failure occurs due to the thermal stresses that arise during the PCB assembly process. These stresses can ... more »
HDI / Blind & Buried Vias
Harry Kennedy, an electrical engineer and technical specialist at Altair, has shared his expertise in optimizing PCB designs ... more »
PCB Design
Laurent Nicolet, the Vice President of Business Units Electronics at the Schmid Group, talks about the future of ... more »
PCB Experts
Syed Ubaid Ali Warsi, the owner of Wavetroniks, provided his insights into high-speed and HDI PCB design strategies ... more »
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.