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Related Categories — High Speed » PCB Materials
Ball Grid Array (BGA): Features, Soldering Technique, and X-Ray Inspection
Electronic devices are shrinking in size and increasing in complexity due to improvements in VLSI technology. The need for more interfacing input/output (I/O) leads and smaller device sizes have increased and this need can be met with the BGA (Ball Grid Array) package.
PCB Assembly
9 Drawing Requirements for Flex PCB
To successfully design a flexible PCB, it is important for the designers to have a basic understanding of ... more »
Flex PCBs
14 Tips For PCB Design For Assembly
Designing with PCB assembly in mind is one of the most important and frequently misunderstood elements. This series is ... more »
PCB Assembly
Ball Grid Array (BGA): Features, Soldering Technique, and X-Ray Inspection
Electronic devices are shrinking in size and increasing in complexity due to improvements in VLSI technology. The need ... more »
PCB Assembly
9 Drawing Requirements for Flex PCB
To successfully design a flexible PCB, it is important for the designers to have a basic understanding of ... more »
Flex PCBs
14 Tips For PCB Design For Assembly
Designing with PCB assembly in mind is one of the most important and frequently misunderstood elements. This series is ... more »
PCB Assembly
A Guide to PCB Stiffeners for Flex and Rigid-Flex
In the PCB assembly, stiffeners are a typical necessity in numerous flex circuit designs. Flexible circuit boards are ... more »
Flex PCBs
Role of PCB Trace Current Capacity in Design
The restrictions posed by the PCB trace current capacity are critically important when it comes to PCB design. ... more »
PCB Design
How to Avoid Crosstalk in HDI Substrates?
Miniaturization of the copper features in electronic circuits results from placing interconnections closely with a high packing density. ... more »
HDI / Blind & Buried Vias
PCB Manufacturing Defects Caused By Land Patterns
PCB land pattern defects should be treated with due attention since their design is very essential for the ... more »
PCB Assembly
How HDI Boards Can Be More Economical
Steve Arobio, who directs PCB manufacturing, and Atar Mittal, who directs PCB design and PCB assembly, insisted this ... more »
HDI / Blind & Buried Vias
How to Master HDI PCB Design
Use these four tips to become a high density interconnect printed circuit board design master.
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards