Miniaturization of the copper features in electronic circuits results from placing interconnections closely with a high packing density. As a result, crosstalk in HDI PCB substrate comes into play because of the increased coupling between the adjacent signal lines.
HDI / Blind & Buried Vias
The designers are constantly challenged to improve the performance of an electronic product. At the same time, the ... more »
High Speed
Avoiding signal integrity issues in a PCB is an extremely complex task for designers. It requires a deep ... more »
Controlled Impedance
Miniaturization of the copper features in electronic circuits results from placing interconnections closely with a high packing density. ... more »
HDI / Blind & Buried Vias
The designers are constantly challenged to improve the performance of an electronic product. At the same time, the ... more »
High Speed
Avoiding signal integrity issues in a PCB is an extremely complex task for designers. It requires a deep ... more »
Controlled Impedance
Signal Integrity (SI) signifies the signal’s ability to propagate along PCB traces without distortion. Signal integrity is about ... more »
PCB Design
When a signal is transmitted, the received signal will always be distorted as a consequence of impedance and ... more »
PCB Design
We previously quickly discussed signal reflection in our PCB transmission line article. This is an in-depth article about ... more »
PCB Design
In this video, Keysight ADS SI application scientist Tim Wang Lee shows you how to use basic signal ... more »
PCB Technologies
Controlled impedance PCBs often include a measurement “coupon”, which typically includes sample traces, 6 inches long and constructed ... more »
Controlled Impedance
For only $3,500, you can now own a precise portable TDR/TDT (Time Domain Reflectometer / Time Domain Transmissometer). ... more »
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