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Related Categories — High Current » PCB Design » PCB Layout » Power Integrity
14 Aviation and Aerospace PCB Design Rules for High Reliability
When you’re designing aerospace and aviation PCBs, you need to consider structural strength, corrosion resistance, heat dissipation, and electrical capabilities. […]
Defense & Space
How Via Impedance Impacts Signal Integrity in PCBs
Just like trace impedance, via impedance is also important in maintaining the signal integrity of your PCB design. ... more »
Signal Integrity
Best PCB Grounding Techniques for High-Power and HDI Designs
Incorporating proper PCB grounding techniques such as dedicated ground planes, ground vias, and galvanic isolation is critical in ... more »
PCB Design
14 Aviation and Aerospace PCB Design Rules for High Reliability
When you’re designing aerospace and aviation PCBs, you need to consider structural strength, corrosion resistance, heat dissipation, and ... more »
Defense & Space
How Via Impedance Impacts Signal Integrity in PCBs
Just like trace impedance, via impedance is also important in maintaining the signal integrity of your PCB design. ... more »
Signal Integrity
Best PCB Grounding Techniques for High-Power and HDI Designs
Incorporating proper PCB grounding techniques such as dedicated ground planes, ground vias, and galvanic isolation is critical in ... more »
PCB Design
Aerospace PCB Design Tips for Efficient Thermal Management
Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with ... more »
PCB Design
How Via Stitching Facilitates High-Current PCB Designs
Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »
PCB Design
Case Study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
How to Optimize Your PCB Trace Using IPC-2152 Standard
IPC-2152 is the standard for determining the current capacity, temperature rise, and width of a trace in a ... more »
IPC
5 DFM Issues Designers Should Check Before PCB Manufacturing
Every PCB should be designed in such a way that the overall cost and chances of potential DFM ... more »
PCB Design
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