High Density Interconnect (HDI) Boards
Sierra Circuits introduces HDI Stackup Planner.
Get a Cost-Optimized, fully manufacturable Stackup for you complete design instantly Click here.
Sierra Circuits has specialized in HDI PCB boards since 1998, and has mature processes for multiple laminations, blind/buried vias, fine pitch,build-up technology and via-in-pad technology. With increasing complexity of applications and form-factor considerations, our customers are rapidly turning to HDI technology for their cutting-edge products.
Our HDI PCB customers include companies such as Cisco, Dell, and NASA.
You can download HDI Brochure here
Benefits of High Density Interconnect (HDI) technology
- Be able to route tight pitch, high pin-count, BGAs, FPGAs
- Reduce layer counts by up to 50% (Example: from 30 layers to 12 layers)
- Reduce weight and size of your PCB with High Density Interconnect Technology
- Better High Speed Signal Integrity
- Benefit from High Reliability
Sierra Circuits' Capabilities in HDI technology
- Fine pitch imaging
- Tightly controlled etching capability
- Tight layer to layer registration
- Sequential Lamination
- Build-up Technology
- Via-in-Pad
HDI Design Guidelines
Sign-up for an online webinar on Design Guidelines for High Density Interconnect Manufacturing.
Please contact Amit Bahl amit@protoexpress.com
High Density Interconnect Constructions
- Via in pad, Filled vias
- Plated thorough hole (PTH) is filled by epoxy resin and plated by cu as lid
- Via in Pad structure can save surface area for wiring enabling the PTH pad to mount to SMT becomes to be able to mount SMT devices
- Discrete capacitor can be reduced inductance for connection
- Minimum PTH diameter is 0.15mm, aspect ratio can be 10
- Staggered vias
- Hole fill is not a requirement
- Stacked vias
- Hole fill required
An example of a complex Blind-via /Sequential Buildup design.
Fine Line Technology
Our R&D team has created a new and very accurate plating process which gives you perfect 2, 3 and 4 mil lines which are required for stable and repeatable impedances for High Technology boards. This Fine Line technology combined with deep blind vias gives you the best combination of technologies to design High Speed circuits with most effective signal integrity.
Our capabilities include but not limited to the following:
- 3/3 is available in one oz copper as a commercial product.
- 2/2 will be available for special high technology projects. With engineering approval in ½ oz copper.
- Any laminate can be produced with 3/3
- Any thickness of inner layer is available in 3/3
- Our 3/3 and 2/2 technology produces a line with almost no under cut.
- Our 3/3 and 2/2 lines are much stronger than most other companies because of the lack of under cut.
For HDI or Fine-line technologies, contact Amit Bahl, amit@protoexpress.com , 408-891-7872
To get a quote submit your gerber files to www.protoexpress.com/customquote
